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 BGA Adapters
Table of Models
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board Index: -40C to 140C (-40F to 284F) Note: Mates with Standard Socket (S) Insulator Size: BGA device body +.079/(2.00mm)
Description: Extraction Slot Adapter (AX) Material: FR-4 Fiberglass Epoxy Board Index: -40C to 140C (-40F to 284F) Note: Mates with Extraction Socket (SB)
Insulator Size: BGA device body +.157/(4.00mm)
Features:
* Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter's lower mass. * Uses same footprint as BGA device. * Custom adapters available for heat sink attachment. * Gold plated screw-machined terminals for superior durability. * Unique SMT Adapter provides reliable solution for mounting or socketing LGA or re-worked BGA devices. * SMT Adapters mate with our BGA Sockets for LGA to BGA conversion or SMT Board to Board applications.
Note: For use with LGA or reworked BGA devices, select surface mount (SMT) terminals which feature solder balls on device side. SMT Adapter terminals may also be used for surface mount board to board applications.
Options Extraction Tool
P/N 8125
* Insert "T" bar end of tool into extraction slot adapter. * Slide tool to end of slot and pry adapter from socket. * Repeat in additional slots until adapter is separated from socket. * Works with LCP or FR-4 sockets.
Extraction Tool Adapter Extraction Slot
BGA Device
Socket
Specifications:
Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Solder Ball: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu Plating: G - Gold over Nickel Gold per ASTM-B-488 Nickel per QQ-N-290
How To Order
1
Footprint Dash #
If Applicable*
F
H A XXX - 715 G
Terminal Plating
RoHS Compliant:
Body Type
RoHS Compliant Insulators:
G - Gold
Terminal Type
See options - available with Standard, male to male, or surface mount terminal styles.
F - FR-4
Pitch G = .050/(1.27mm) H = .039/(1.00mm) J = .0315/(0.80mm)
Number of Positions Model Type A = Standard Adapter AX = Extraction Slot Adapter (1.27 and 1.00mm only)
*See footprints section or online database.
Note: See pages 4-5 for 0.50mm and 0.65mm pitch. Consult factory for custom 0.75mm pitch designs. For SMT Adapters, select Model Type A or AX and appropriate SMT Terminal Type from page 7.
5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Ball Grid Array (BGA) Adapters
For use with BGA Sockets on pages 8-9
Standard Terminals
Type -638
1.27mm pitch
BGA Adapters
Type -700
0.80mm pitch
Additional standard and custom terminals available. See Terminals section or consult factory.
Type -715
1.00mm pitch
Standard
.062 (1.57)
.182 (4.62)
.159 (4.04)
.146 (3.71) .009 (0.23)Dia.
.018 (0.46) Dia.
.010/(0.25) Dia.
Type -721
1.27mm pitch
Type -735
1.00mm pitch
Type -732
0.80mm pitch
Male to Male
.062 (1.57) .342 (8.69) .218 (5.54) .230 (5.84)
Footprints:
360 Pins Footprint Number 360-2
.906 Sq. (23.00)
2X .018/(0.44) Dia.
2X .011/(0.28) Dia.
2X .009/(0.23) Dia.
Tin/Lead: Type -720 Lead-free: Type -823
Tin/Lead: Type -737 Lead-free: Type -824
1.00mm pitch .024/(0.61) Dia. Solder Ball
Tin/Lead: Type -736 Lead-free: Type -829
0.80mm pitch .020/(0.51) Dia. Solder Ball
SMT (Surface Mount)
1.27mm pitch .030/(0.76) Dia. Solder Ball
.062 (1.57)
.182 (4.62) .010/(0.25) Dia.
.159 (4.04)
.146 (3.71)
.039/(1.00) Typ.
.018/(0.46) Dia.
.009/(0.23) Dia.
22 x 22 rows * Footprint specific insulators drilled to exact device pattern.
How It Works
See page 15 for Generic Reflow Profiles. * Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. * PC boards can be processed with Tin/Lead BGA sockets in standard profiles or lead-free BGA sockets in RoHS Compliant, high temperature profiles.
* Over 1000 footprints available see page 88, search online or submit your device specs. * Use our Build-A-Part feature or search in our online BGA Socket FinderTM at www.bgasockets.com.
Reflow (solder) BGA Device to Adapter
Available Online:
* RoHS Qualification Test Report * Technical articles * Test data * Signal Integrity Performance * CAD Drawings * BGA Footprints
Reflow (solder) Socket to PCB (See pgs. 8-9 for sockets)
Dimensional Information
BGA Body + .079/(2.0) .039/(1.0)
BGA Device
Standard Adapter (A)
* Mates with Standard Socket (S) * Adapter size equals BGA Device body + .079/(2.00)
BGA Body + .157/(4.0) .079/(2.0)
BGA Device
Extraction Slot Adapter (AX)
* Slots allow AIC extraction tool (sold separately) to easily remove device/adapter assembly from socket * Mates with Extraction Socket (SB) * Adapter size equals BGA Device body + .157/(4.00)
5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16 rev. Sept. 07
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
BGA Adapter Sockets
Ball Grid Array (BGA) Adapter Sockets
For use with BGA Adapters on pages 6-7
Table of Models
Insulator Size: Description: Standard Socket (S) Mat'l: High Temp. Liquid Crystal Polymer (LCP)* Same size as BGA device body Index: -60C to 260C (-76F to 500F)
Insulator Size: Description: Extraction Socket (SB) Mat'l: High Temp. Liquid Crystal Polymer (LCP)* 1.27mm Pitch: BGA device body Index: -60C to 260C (-76F to 500F) +.079/(2.00) 1.00mm Pitch: BGA device body +.138/(3.50)
Features:
* Advanced(R) exclusive solder ball terminals offer superior SMT processing. * Same footprint as BGA device. * Proven long-term performance in vigorous temperature cycling applications - solder ball terminal absorbs TCE mismatch. * Closed bottom socket terminal for 100% anti-wicking of solder. * Gold contacts allow gold/gold interconnections to Adapter pins. * Low insertion force socket with multi-fingered high reliability Beryllium Copper contacts. * Coplanarity consistently under .006 inch industry standard. * Custom designs available.
RGS/RGSB replaces MGS/MGSB, MHS/MHSB replaces FHS/FHSB. * Some sizes may only be available in FR-4. See How To Order section or consult factory.
Options Tape and Reel Packaging
* Conforms to EIA-481 Standard. * Pick-up tape included. * Add -TR to end of part number when ordering. * Custom packaging available * If -TR is not specified, standard tray packs are used.
* Extraction tool (P/N 8125) is available separately. * Works with Extraction Slot Adapters and LCP or FR-4 sockets.
Specifications:
Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper (C17200) ASTM-B-194 Solder Ball: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu Plating: G - Gold over Nickel Gold per ASTM-B-488 Nickel per QQ-N-290
How To Order
1
Footprint Dash #
If Applicable*
M
H S XXX - 788 G G
Contact Plating
RoHS Compliant:
Body Type
RoHS Compliant Insulators:
G - Gold
Terminal Plating F - FR-4 (0.80mm pitch) RoHS Compliant: M - Molded LCP (1.00mm pitch)* G - Gold R - Molded LCP (1.27mm pitch) Terminal Type *some sizes may be available in FR-4 only See options Pitch G = .050/(1.27mm) Number of Positions H = .039/(1.00mm) *See footprints section or online database. Model Type J = .0315/(0.80mm) S = Standard Socket SB = Extraction Socket (1.27 and 1.00mm only)
Note: See pages 4-5 for 0.50mm and 0.65mm pitch.
5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16 rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Ball Grid Array (BGA) Adapter Sockets
For use with BGA Adapters on pages 6-7
Standard Terminals
Tin/Lead: Type -636 Lead-free: Type -819
1.27mm pitch
Additional standard and custom terminals available. See Terminals section or consult factory.
Tin/Lead: Type -790 Lead-free: Type -788
1.00mm pitch
BGA Adapter Sockets
Tin/Lead: Type -702 Lead-free: Type -828
0.80mm pitch
SMT (Surface Mount)
.117 (2.97)
.095 (2.41)
.105 (2.67)
.088 (2.24)
.125 (3.18)
.030 Dia. (0.76) PATENTED
.024 Dia. (0.61) PATENTED PATENTED
.020 Dia. (0.51)
Type -673
1.27mm pitch
Type -789
1.00mm pitch
Type -731
0.80mm pitch
Thru-Hole
.117 (2.97)
.095 (2.41)
.105 (2.67)
.088 (2.24)
.125 (3.18)
Footprints:
.080 (2.03)
.128 (3.25) .018 Dia. (0.46)
.125 (3.18) .011 Dia. (0.28) .011 Dia. (0.28)
360 Pins Footprint Number 360-2
.906 Sq. (23.00)
How It Works
See page 15 for Generic Reflow Profiles. * Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. * PC boards can be processed with Tin/Lead BGA sockets in standard profiles or lead-free BGA sockets in RoHS Compliant, high temperature profiles.
.039/(1.00) Typ.
Reflow (solder) BGA Device to Adapter (See pgs. 6-7)
22 x 22 rows * Full grid molded insulators populated to exact device pattern. * Over 1000 footprints available see page 88, search online or submit your device specs. * Use our Build-A-Part feature or search in our online BGA Socket FinderTM at www.bgasockets.com.
Reflow (solder) Socket to PCB
Available Online: Dimensional Information
Same Size as BGA Body
BGA Socket PC Board
* RoHS Qualification Test Report
Standard Socket (S)
* Mates with Standard Adapter (A) * Socket size same as BGA device body * Use with SMT Adapter for LGA and reworked BGA device socketing (or board to board applications)
* Technical articles * Test data * Signal Integrity Performance * CAD drawings * Generic Tin/Lead and Lead-free Reflow Profiles
BGA Body + .079/(2.00) or + .138/(3.50)
BGA Socket PC Board
Extraction Socket (SB)
* Mates with Extraction Slot Adapter (AX) * Socket size equals BGA body + .079/(2.00) for 1.27mm pitch or BGA body + .138/(3.50) for 1.00mm pitch * Protects valuable PCB during device/adapter extraction - tool never touches PCB * Available in 1.00 and 1.27mm pitch only
5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 info@advanced.com | www.advanced.com Catalog 16 rev. Sept. 07
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.


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